MIICAM MX-30 Thermal Paste

Product Overview

The MIICAM MX-30 thermal paste is designed to improve heat transfer between heated electronic components (such as processors, video chips, and transistors) and cooling systems — heat sinks, coolers, or heat pipes. It provides efficient heat dissipation, prevents overheating, and increases the stability and reliability of electronic equipment.

General Specifications

• Model: MIICAM MX-30
• Product Type: Thermal conductive paste (thermal grease)
• Thermal Conductivity: 13.5 W/m·K (value may vary depending on batch)
• Volume / Weight: 30 g
• Color: Gray
• Density: ~2.6 g/cm³
• Operating Temperature Range: –50 °C to +250 °C
• Electrical Conductivity: None (electrically non-conductive)
• Viscosity: Medium, easy to apply evenly
• Base: Silicone oil with micro-particles of high thermal conductivity metal oxides

Advantages:

• High thermal conductivity ensures efficient heat dissipation
• Electrically non-conductive — prevents short circuits
• Easy to apply and spreads evenly on the surface
• Long-term durability and stability of characteristics
• Compatible with most cooling systems and materials (aluminum, copper, nickel)

Applications:

• Central processing units (CPU)
• Video chips and graphics processors (GPU)
• Chipsets, memory modules, power transistors
• Radio-electronic and industrial equipment